收藏本站
Introduction
Chapter 16, RAM Disk. This chapter demonstrates the use of the simplest storage
medium, the RAM disk.
Chapter 17, SD/MMC Devices. SD and MMC cards are flash-based removable storage
devices commonly used in consumer electronics. For embedded CPUs, a SD/MMC card is
an appealing medium because of its simple and widely-supported physical interfaces (one
choice is SPI). This chapter describes the interface and function of these devices.
Appendix A, μC/FS API Reference Manual. The reference manual describes every API
function. The arguments and return value of each function are given, supplemented by
notes about its use and an example code listing.
Appendix B, μC/FS Error Codes. This appendix provides a brief explanation of μC/FS
error codes defined in fs_err.h .
Appendix C, μC/FS Porting Manual. The portability of μC/FS relies upon ports to
interface between its modules and the platform or environment. Most of the ports constitute
the board support package (BSP), which is interposed between the file system suite (or
driver) and hardware. The OS port adapts the software to a particularly OS kernel. The
porting manual describes each port function.
Appendix D, μC/FS Types and Structures. This appendix provides a reference to the
μC/FS types and structures.
Appendix E, μC/FS API Configuration Manual. μC/FS is configured via defines in a
single configuration file, fs_cfg.h. The configuration manual specifies each define and the
meaning of possible values.
Appendix F, μC/FS Shell Commands. A familiar method of accessing a file system, at
least to engineers and computer scientists, is the command line. In an embedded system, a
UART is a port over which commands can be executed easily, even for debug purposes. A
set of shell commands have been developed for μC/FS that mirror the syntax of UNIX
utilities, as described in this chapter.
Appendix G, Bibliographhy.
Appendix H, Licensing Policy.
21
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
AD-UCOS3-SPRD PRD LIC UCOS3 RTOS CORE CCES SGL
AD-UCUSBD-SPRD PRD LIC UCUSB DEV CORE CCES SGL
AD637-EVALZ BOARD EVALUATION FOR AD637
AD736-EVALZ BOARD EVALUATION FOR AD736
AD737-EVALZ BOARD EVALUATION FOR AD737
AD8007AKS-EBZ BOARD EVAL FOR AD8007AKS
AD8018ARU-EVAL BOARD EVAL FOR AD8018
AD8034ART-EBZ BOARD EVAL FOR AD8034ART
相关代理商/技术参数
ADuC-H7020 功能描述:开发板和工具包 - ARM HDR BRD FOR ADUC7020 ARM7 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
ADuC-IO7020 功能描述:开发板和工具包 - ARM DEV BRD FOR ADUC7020 ARM7 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V
ADUCM3027BCBZ-R7 功能描述:LOWPWR CORTEXM3W/128KKEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1,500
ADUCM3027BCBZ-RL 功能描述:LOWPWR CORTEXM3W/128KKEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:5,000
ADUCM3027BCPZ 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:托盘 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C，SPI，UART/USART 外设:DMA，POR，PWM，WDT I/O 数:44 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源（Vcc/Vdd）:1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP（9x9） 标准包装:1
ADUCM3027BCPZ-R7 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:剪切带（CT） 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C，SPI，UART/USART 外设:DMA，POR，PWM，WDT I/O 数:44 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源（Vcc/Vdd）:1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP（9x9） 标准包装:1
ADUCM3027BCPZ-RL 功能描述:IC MCU 32BIT 128KB FLASH 64LFCSP 制造商:analog devices inc. 系列:ADuCM 包装:带卷（TR） 零件状态:在售 核心处理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:26MHz 连接性:I2C，SPI，UART/USART 外设:DMA，POR，PWM，WDT I/O 数:44 程序存储容量:128KB（128K x 8） 程序存储器类型:闪存 EEPROM 容量:- RAM 容量:96K x 8 电压 - 电源（Vcc/Vdd）:1.74 V ~ 3.6 V 数据转换器:A/D 8x12b 振荡器类型:内部 工作温度:-40°C ~ 85°C（TA） 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP（9x9） 标准包装:2,500
ADUCM3029BCBZ-R7 功能描述:LOWPWR CORTEX M3W/256KEMBEDDED F 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1,500